According to the market feedback, the current laser cutting machine can precisely cut flexible circuit boards and organic covering films without special pressure and mold fixing. The high-energy laser source can be overused and the laser beam can be accurately controlled, which can effectively improve the processing speed and obtain more accurate processing results. Through the combined movement of galvanometer scanning and linear motor two-dimensional platform, the machining difficulty is not increased due to the complex shape and tortuous curvature. Laser cutting is commonly used for precision molding of flexible circuit boards, soft and hard bonded boards, and FPC film windowing.
Precision laser cutting machine
1、 Application of laser precision cutting in forming FPC:
1. The flexible circuit board laser processing technology is mainly applied to FPC profile cutting, covering film window opening, drilling, etc. The following main benefits:
2. It can be directly used for laser cutting according to CAD data, which is more convenient and fast, and can greatly shorten the delivery cycle.
3. Do not increase the processing difficulty due to complex shape and curved path.
4. When opening the cover film, the edge of the cut cover film can be made to be complete, smooth, without burr and glue overflow. It is inevitable that burrs and glue spills after punching will occur near the window when the window is opened by molding machine. Such burrs and glue spills are difficult to remove after the bonding pressure on the pad, which directly affects the quality of the subsequent coating.
5. Flexible plate sample processing often changes the covering film window due to the customer's need to change the line and pad position, and the mold needs to be replaced or modified by traditional methods. When laser processing is used, this problem can be easily solved, because only the modified computer-aided design data can be imported, the covering film that wants to open the window graphics can be easily and quickly processed, which will win the opportunity of market competition for the company in terms of time and cost.
6. Precision laser cutting machine is an ideal tool for flexible circuit board molding. Lasers can process materials into any shape.
7. In the past mass production, many parts were formed by using mechanical stamping forming dies. However, the process loss of hard stamping die is large and the lead time is long, so it is not practical for parts processing and molding, and the cost is very high.
FPC flexible circuit board
2、 FPC market analysis report:
In the early days, FPC was only used in military, aerospace and other special industries. With the development of various information terminal equipment, FPC was gradually applied to civil and commercial fields. The growth mode dominated by the growth of consumer electronics in recent years mainly includes the following aspects:
1. Personal computers: including desktop computers and notebook computers, as well as wearable computers in production.
2. External computer. The above two markets have the largest global demand for FPC, but the growth rate is slow.
3. Mobile phone: 6 to 10 FPCs are used in flip phone. These FPCs are mainly single-chip and double-sided. The FPC is used for a display module and a photographing module of a multilayer structure.
4. Audio and video equipment is the third application field of FPC: portable products (such as MP3, MP4, mobile TV, mobile DVD, etc.) and flat panel displays will continue to increase the number of FPC.
5. Other application markets also include medical devices, automobiles and instruments.
FPC laser cutting machine
3、 The development trend of FPC in the future mainly includes three aspects:
1. The development of TFT-LCD and PDP display technology promotes the development of single-sided and double-sided display towards high density. The alignment is fine and the aperture is small. The line width of single-sided and double-sided FPC lines is 1.5mil/1.5mil, and the aperture diameter is 0.1 ~ 0.05mm.
2. The two-layer method of FCCL flexible copper clad laminate with high dimensional stability is adopted. Due to the demand for mobile phones with high flexibility requirements and TFT-LCD products with high dimensional stability requirements, the technology of two-layer FCCL flexible copper plate is mature and the price is cheap. The utilization rate of adhesive free two-layer FCCL is getting higher and higher.
3. Develop to COF (chiponflex). Driven by TFT-LCD and integrated circuit packaging substrate market, COF has a good development momentum, and the line distance of single-sided COF is 10 μ m. And the line spacing of the double-sided COF is 15 μ m. The aperture of the small hole is less than 50 μ m。