In the electronic industry, FPC can be said to be the blood transfusion pipeline of electronic products. With the rise of various intelligent industry giants, the requirements for the application and processing of circuit boards are becoming higher and higher. In the past, mobile phones only needed a heavy circuit board. Now, with the development of intelligence in the electronic industry, the layers of PCB are more and more, smaller and thinner. In addition, FPC friction plates need to be configured to accommodate more and more electronic components, and the requirements for processing accuracy are also higher and higher. As a non-contact processing tool, laser can concentrate high energy to process materials such as laser cutting, drilling, marking, welding and scribing.
Laser has three major functions in the manufacturing process of flexible circuit board: cutting, upper cover and drilling.
Advantages of FPC laser cutting
The advantages of laser cutting machine in FPC manufacturing process mainly include:
1. It can cut any shape of graphics, which is convenient and fast, and can greatly shorten the delivery cycle;
2. It does not increase the processing difficulty due to the complex shape and path bending;
3. When the cover film is opened, the edge of the cut cover film shall be neat, smooth and free of burr and glue overflow. After the traditional die processing method is pressed, the edge burr and glue overflow are easy to occur.
4. Laser processing has high precision and is an ideal tool for circuit board forming; The material can be processed into any shape.
5. Ensure the perpendicularity of the edge of the cutting surface; Successfully compensate the machining error caused by FPC deformation;
6. The cut of FPC plate is narrow and there is no carbonization, which effectively ensures the product size and quality and saves the material cost.
7. Because customers need to modify the line and pad position, FPC sample processing often changes the cover film window. Traditional molds need to be replaced or modified, and laser processing can be easily solved. Just import the drawings into the system, you can win the opportunity of market competition in terms of time and cost.
8. In large-scale production, many small parts are stamped with the die formed by mechanical hard stamping. However, due to the large amount of loss and long lead time of the hard film process, it is not practical for the processing and molding of small parts.