When it comes to the purchase of PCB laser cutting machine, depaneling equipment investment costs are high, the procurement process requirements will of course seem to be very acting. Compared to other PCB depanelization equipment, PCB laser cutting machine has a higher technical threshold and requires more technical information for reference. For customers, these strange information seems more very difficult to understand, so how to understand PCB laser cutting, depaneling equipment, here Laissez Faire laser through the instructions in this article to bring you some reference hope to help you.

As a manufacturer, our first choice is to understand the needs of customers and recommend the appropriate models according to customer needs, such as aluminum-based, epoxy resin, FR4, fiberglass board, PCB product specifications.

PCB laser depaneling

1.Material

According to the material suggested to use the corresponding equipment, aluminum base. Copper substrate is usually used QCW fiber laser cutting board, early also used CO2 laser cutting board, with the progress of technology, gradually replace other materials, such as green or UV laser PCB laser cutting machine.

2. The speed of processing products, processing results

PCB laser cutting machine can meet the requirements of a flat cross-section, no burr, no stress, no deformation, and can process PCB sub-board containing components. However, the processing speed will have an impact on the processing effect, the equipment recommended in this paper is UV PCB laser cutting, depaneling machine and green light PCB laser cutting.

Using UV laser devices, the processing effect is good, but the efficiency is low. Using the green laser device, the processing effect is not as good as the UV laser, but the efficiency is higher. At the same time, the greater the thickness of the plate, the lower the processing efficiency, the worse the processing effect. There is no doubt that it is a very fast process. Even a 2mm plate can be perfect as long as the speed is not counted. In terms of processing speed, the better the material absorbs light, the faster it is. For example, a paper substrate of the same thickness is faster than an epoxy resin. As the laser power increases, the single pulse energy and repetition frequency increases, the cutting speed is accelerated.

PCB laser cutting

3. Processing range, processing slit

PCB laser cutting machine processing method is to scan back and forth through the vibrating mirror, so there are two reference points: the processing width of the vibrating mirror and the processing width of the table. Vibrating mirror processing width refers to a single processing work area, its effective width is a valid parameter for the size of the PCB. In addition to aluminum and copper substrates, the general laser depaneling machine can be controlled within 100 microns, the thinner the thin board, the smaller the processing gap.

4. Carbonization

The phenomenon of carbonization essentially reflects the processing effect. Charring is not the cutting surface, but the cutting section. The charring is caused by the thermal effect of the high-energy beam vaporization on the one hand, and the smoke generated during vaporization sticking to the cross section on the other.

Therefore, to solve this problem, the laser processing frequency must first be increased. Pulse energy and average power. Another approach is to reduce the cutting speed, to reduce the carbonization and to include an auxiliary dust removal device. Of course, those demanding customers want to be completely free of blackout, but are very inefficient and difficult to be compatible with.